• High performance Copper Clad Laminates for advanced applications
  • Copper Clad Laminates for general applications
  • High thermal conductive materials for Heat dissipation substrate
  • Multilayer CCL with internal circuitries
  • White colored CCL for Surface Mount Device LED
  • High Tg Glass/Epoxy tape for semiconductor direct bonding
  • Metal base PWB material
  • Stiffener for Flexible Printed Wiring board
  • Rubber clad laminates for Aluminum electrolytic capacitor
  • High Tg bonding sheet for PWB processing
  • Halogen-free and Dust-free prepreg with least resin flow

High performance Copper Clad Laminates for advanced applications

Glass/Epoxy tape for Smart card’s terminal

Aluminum base PWB materials

White CCL for SMD LED

High thermal conductive bonding sheet

Rubber clad laminates for electrolytic capacitor

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